بحث علمي
A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue
Journal of Electronic Materials, 1-12, 2023
سنة النشر
2023
الاستشهادات
3
عدد المؤلفين
6
المؤلفون
RR Kurniawan
BT Sayed
A Sari
JP Luna
AK Kareem
NA Hussien
الباحثون في المنصة
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