Research Article
A Micromechanical Data-Driven Machine-Learning Approach for Microstructural Characterization of Solder Balls in Electronic Packages Subjected to Thermomechanical Fatigue
Journal of Electronic Materials, 1-12, 2023
Publication Year
2023
Citations
3
Authors
6
Authors
RR Kurniawan
BT Sayed
A Sari
JP Luna
AK Kareem
NA Hussien
Researchers on Platform
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